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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9725367 B1

PDFFull Text
Date of Patent:
Aug. 08, 2017

Filed:

Mar. 18, 2014

Apparatus and method for producing (metal plate)-(ceramic board) laminated assembly, and apparatus and method for producing power-module substrate

Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Sotaro Oi, Kitamoto, JP;

Takayuki Kawasaki, Kitamoto, JP;

Assignee:

MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;

Attorneys:

Locke Lord LLP

Howard M. Gitten

Primary Examiner:

Kiley Stoner

Int. Cl.
CPC ...
B23K 31/02 (2006.01); C04B 37/02 (2006.01); H01L 23/373 (2006.01); H05K 3/02 (2006.01); B23K 1/19 (2006.01); B23K 1/00 (2006.01); H01L 21/48 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H05K 3/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C04B 37/026 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); H01L 21/4882 (2013.01); H01L 21/677 (2013.01); H01L 21/67098 (2013.01); H01L 21/67109 (2013.01); H01L 21/67144 (2013.01); H01L 21/67248 (2013.01); H01L 23/3735 (2013.01); H05K 3/0061 (2013.01); H05K 3/022 (2013.01); C04B 2237/121 (2013.01); C04B 2237/125 (2013.01); C04B 2237/126 (2013.01); C04B 2237/127 (2013.01); C04B 2237/128 (2013.01); C04B 2237/343 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/402 (2013.01); C04B 2237/407 (2013.01); C04B 2237/704 (2013.01); C04B 2237/706 (2013.01); C04B 2237/86 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0306 (2013.01); H05K 2203/068 (2013.01); H05K 2203/163 (2013.01);
Abstract

Provided are: an apparatus and a method for producing a (metal plate)-(ceramic board) laminated assembly, a bonding material and a metal plate during the bonding of the metal plate to the ceramic board through the bonding-material layer and an apparatus and a method for producing a power-module substrate. An apparatus for producing a (metal plate)-(ceramic board) laminated assembly by laminating a metal plate having a temporary bonding material formed thereon on a ceramic board having a bonding-material layer formed thereon, the apparatus being equipped with: a conveying device which conveys the metal plate onto the ceramic board to laminate the ceramic board and the metal plate on each other; and a heating device which is arranged in the middle of a passage of the conveyance of the metal plate by the conveying device and melts the temporary-bonding material on the metal plate.

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