The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2017

Filed:

Mar. 27, 2015
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Kenji Shinkai, Tokyo, JP;

Tadakazu Sone, Tokyo, JP;

Hideo Aizawa, Tokyo, JP;

Hiroshi Aono, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/34 (2012.01); B24B 53/017 (2012.01);
U.S. Cl.
CPC ...
B24B 37/34 (2013.01); B24B 53/017 (2013.01);
Abstract

There is provided a cover to which a polishing liquid is less likely to stick and solidify. The cover for a component of a polishing apparatus for polishing substrates is provided with a locking mechanism disposed inside the cover and configured to latch together a main body of the component and the cover. An external surface of the cover exposed to the outside has no recessed portion, and has no horizontal plane, except on the top portion of the cover.


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Shinkai, Kenji. (2017). Cover for component of polishing apparatus, component of polishing apparatus, and polishing apparatus (U.S. Patent No. 9724798). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9724798

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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