The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Jun. 06, 2016
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Kai-Kuen Chang, Keelung, TW;

Chia-Min Hung, Hsinchu, TW;

Shih-Yin Hsiao, Chiayi County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/40 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7816 (2013.01); H01L 29/0653 (2013.01); H01L 29/1083 (2013.01); H01L 29/1095 (2013.01); H01L 29/402 (2013.01); H01L 29/404 (2013.01); H01L 29/4238 (2013.01); H01L 29/42368 (2013.01); H01L 29/66659 (2013.01); H01L 29/66681 (2013.01); H01L 29/7833 (2013.01); H01L 29/7834 (2013.01); H01L 29/7835 (2013.01);
Abstract

A manufacturing method of a high-voltage metal-oxide-semiconductor (HV MOS) transistor device is provided. The manufacturing method includes the following steps. A semiconductor substrate is provided. A patterned conductive structure is formed on the semiconductor substrate. The patterned conductive structure includes a gate structure and a first sub-gate structure. The semiconductor substrate has a first region and a second region respectively disposed on two opposite sides of the gate structure. The first sub-gate structure is disposed on the first region of the semiconductor substrate. The first sub-gate structure is separated from the gate structure. A drain region is formed in the first region of the semiconductor substrate. A first contact structure is formed on the drain region and the first sub-gate structure. The drain region is electrically connected to the first sub-gate structure via the first contact structure.


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