The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Jan. 16, 2015
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Takaaki Tominaga, Tokyo, JP;

Naoyuki Kawabata, Tokyo, JP;

Nobuyuki Tomita, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/161 (2006.01); H01L 29/872 (2006.01); H01L 29/47 (2006.01); H01L 29/36 (2006.01); H01L 29/861 (2006.01); H01L 29/16 (2006.01); H01L 29/32 (2006.01); H01L 29/66 (2006.01); H01L 29/04 (2006.01); H01L 29/10 (2006.01); H01L 29/167 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/063 (2013.01); H01L 29/045 (2013.01); H01L 29/0619 (2013.01); H01L 29/1095 (2013.01); H01L 29/167 (2013.01); H01L 29/1608 (2013.01); H01L 29/32 (2013.01); H01L 29/36 (2013.01); H01L 29/47 (2013.01); H01L 29/6606 (2013.01); H01L 29/66068 (2013.01); H01L 29/7802 (2013.01); H01L 29/8611 (2013.01); H01L 29/872 (2013.01);
Abstract

A silicon carbide semiconductor device capable of achieving a decrease in ON resistance and an increase in breakdown voltage and a method for manufacturing a silicon carbide semiconductor device. A silicon carbide semiconductor device includes a silicon carbide substrate and a drift layer. The drift layer includes a breakdown voltage holding layer extending from a point where a doping concentration has a predetermined value to a surface of the drift layer. The doping concentration in the breakdown voltage holding layer continuously decreases from the point where the doping concentration has the predetermined value to a modulation point located further toward the surface of the drift layer than a midpoint in a film thickness direction of the breakdown voltage holding layer. The doping concentration in the breakdown voltage holding layer continuously increases from the modulation point to the surface of the drift layer.


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