The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2017
Filed:
Nov. 30, 2016
J-devices Corporation, Usuki, Oita, JP;
Naoki Hayashi, Yokohama, JP;
J-Devices Corporation, Usuki, JP;
Abstract
Provided is a bonding method to construct a bonding with high thermal reliability between electrodes formed on both chip surfaces of a semiconductor device and wiring. The bonding method includes: bonding a semiconductor chip over a first substrate with a bonding film interposed therebetween; forming a first insulating film over the semiconductor chip; forming a first via in the first insulating film; forming a first wiring over the first insulating film so as to be electrically connected to the semiconductor chip through the first via; forming a second via in the bonding film; and forming a second wiring under the semiconductor chip so as to be electrically connected to the semiconductor chip through the second via.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile