The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Dec. 07, 2016
Applicant:

Nexperia B.v., Eindhoven, NL;

Inventors:

Chanon Suwankasab, Bangkok, TH;

Amornthep Saiyajitara, Bangkok, TH;

Surachai Tangsiriratchatakun, Bangkok, TH;

Chayathorn Saklang, Bangkok, TH;

Assignee:

Nexperia B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/30 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01G 2/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49589 (2013.01); H01G 2/02 (2013.01); H01L 21/4825 (2013.01); H01L 23/49513 (2013.01); H01L 23/49541 (2013.01); H05K 1/183 (2013.01); H05K 3/303 (2013.01); H05K 3/305 (2013.01);
Abstract

A packaged electronic device has first and second lead frame leads and a passive electronic component mounted, across a gap between the leads, on the top sides of the leads, using an adhesive. Facing lateral sides of the leads each include a recess that receives the adhesive. The recess promotes adhesion between the electronic component and the corresponding lead while limiting spread of the adhesive on the bottom side of the electronic component. The adhesive in the recesses promotes adhesion of the component to the leads by inhibiting cracking, and enhances inspection capability at the device backside.


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