The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2017
Filed:
Nov. 20, 2015
Shinko Electric Industries Co., Ltd., Nagano, JP;
Ryo Fukasawa, Nagano, JP;
Michio Horiuchi, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A semiconductor device includes a first electronic component mounted to an upper face of a plated interconnect layer, a second electronic component mounted to a lower face of the plated interconnect layer, a first resin part covering the first electronic component on an upper side of the plated interconnect layer, and a second resin part covering the second electronic component on a lower side of the plated interconnect layer, wherein the first and second electronic components at least partially face each other across the plated interconnect layer, wherein the plated interconnect layer includes a sloping portion disposed on a sloping boundary between the first and second resin parts, and wherein an end part of the sloping portion is bent to have a face thereof exposed from the second resin part, and a lower surface of the second resin part is flush with the face of the end part.