The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2017
Filed:
Mar. 18, 2015
Sandia Corporation, Albuquerque, NM (US);
Triquint Semiconductor, Inc., Hillboro, OR (US);
Cody M. Washburn, Albuquerque, NM (US);
Timothy N. Lambert, Albuquerque, NM (US);
David R. Wheeler, Albuquerque, NM (US);
Christopher T. Rodenbeck, Alexandria, VA (US);
Tarak A. Railkar, Plano, TX (US);
National Technology & Engineering Solutions of Sandia, LLC, Albuquerque, NM (US);
Qorvo US, Inc., Greensboro, NC (US);
Abstract
Various technologies presented herein relate to forming one or more heat dissipating structures (e.g., heat spreaders and/or heat sinks) on a substrate, wherein the substrate forms part of an electronic component. The heat dissipating structures are formed from graphene, with advantage being taken of the high thermal conductivity of graphene. The graphene (e.g., in flake form) is attached to a diazonium molecule, and further, the diazonium molecule is utilized to attach the graphene to material forming the substrate. A surface of the substrate is treated to comprise oxide-containing regions and also oxide-free regions having underlying silicon exposed. The diazonium molecule attaches to the oxide-free regions, wherein the diazonium molecule bonds (e.g., covalently) to the exposed silicon. Attachment of the diazonium plus graphene molecule is optionally repeated to enable formation of a heat dissipating structure of a required height.