The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Jan. 12, 2016
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Bernard Previtali, Grenoble, FR;

Maud Vinet, Claix, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/84 (2006.01); H01L 27/06 (2006.01); H01L 21/8238 (2006.01); H01L 27/02 (2006.01); H01L 21/768 (2006.01); H01L 23/485 (2006.01); H01L 23/528 (2006.01); H01L 23/535 (2006.01); H01L 21/822 (2006.01);
U.S. Cl.
CPC ...
H01L 21/84 (2013.01); H01L 21/76895 (2013.01); H01L 21/823871 (2013.01); H01L 23/485 (2013.01); H01L 23/5286 (2013.01); H01L 23/535 (2013.01); H01L 27/0251 (2013.01); H01L 27/0694 (2013.01); H01L 21/8221 (2013.01);
Abstract

A method for making a three-dimensional integrated electronic circuit is provided, including making a first electrically conductive portion on a first dielectric layer covering a first semiconductor layer; then making a second dielectric layer covering the first electrically conductive portion such that it is disposed between the first and second dielectric layers, and a second semiconductor layer disposed on the second dielectric layer; then making a first electronic component in the second semiconductor layer, and a second electronic component in the first semiconductor layer; then making an electrical interconnection electrically linking the first and second electronic components together, of which a first part passes through the first dielectric layer and electrically connects the second electronic component to the first electrically conductive portion and of which a second part passes through a part of the second dielectric layer and electrically connects the first electronic component to the first electrically conductive portion.


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