The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2017
Filed:
Jul. 09, 2014
Applicant:
Novellus Systems, Inc., Fremont, CA (US);
Inventors:
Steven T. Mayer, Lake Oswego, OR (US);
David W. Porter, Sherwood, OR (US);
Mark J. Willey, Portland, OR (US);
Robert Rash, Portland, OR (US);
Assignee:
Novellus Systems, Inc., Fremont, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/288 (2006.01); C25D 5/34 (2006.01); C25D 17/00 (2006.01); C25D 5/00 (2006.01); C25D 7/12 (2006.01); C25D 21/04 (2006.01); C25D 5/02 (2006.01); C25D 3/38 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/2885 (2013.01); C25D 5/003 (2013.01); C25D 5/02 (2013.01); C25D 5/34 (2013.01); C25D 7/123 (2013.01); C25D 17/001 (2013.01); C25D 21/04 (2013.01); H01L 21/76861 (2013.01); C25D 3/38 (2013.01);
Abstract
Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. Disclosed compositions of the pre-wetting fluid prevent corrosion of a seed layer on the wafer and also improve the filling rates of features on the wafer.