The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Oct. 02, 2013
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung Hsien, TW;

Inventors:

Pin-Cheng Huang, Taichung Hsien, TW;

Yi-Che Lai, Taichung Hsien, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); G01R 1/04 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0408 (2013.01); G01R 31/2886 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A method of testing a semiconductor structure is provided, including providing at least a semiconductor structure having an interposer and a semiconductor element disposed on the interposer; disposing the semiconductor structure on a carrier having a supporting portion, with the interposer being supported by the supporting portion; and performing a test process. The semiconductor structure has been tested for its electrical performance prior to packaging, thereby eliminating the necessity for a conductive pathway to pass through an inner circuit of an package substrate. Therefore, the testing process is accelerated and the time is save.


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