Electrical isolation of finfet active region by selective oxidation of sacrificial layer

Abstract

A semiconductor stack of a FinFET in fabrication includes a bulk silicon substrate, a selectively oxidizable sacrificial layer over the bulk substrate and an active silicon layer over the sacrificial layer. Fins are etched out of the stack of active layer, sacrificial layer and bulk silicon. A conformal oxide deposition is made to encapsulate the fins, for example, using a HARP deposition. Relying on the sacrificial layer having a comparatively much higher oxidation rate than the active layer or substrate, selective oxidization of the sacrificial layer is performed, for example, by annealing. The presence of the conformal oxide provides structural stability to the fins, and prevents fin tilting, during oxidation. Selective oxidation of the sacrificial layer provides electrical isolation of the top active silicon layer from the bulk silicon portion of the fin, resulting in an SOI-like structure. Further fabrication may then proceed to convert the active layer to the source, drain and channel of the FinFET. The oxidized sacrificial layer under the active channel prevents punch-through leakage in the final FinFET structure.