The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2017

Filed:

Jun. 12, 2015
Applicant:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Inventors:

Hao Zhong, Shanghai, CN;

Yunchu Yu, Shanghai, CN;

Yihua Shen, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/088 (2006.01); H01L 23/58 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0886 (2013.01); H01L 23/585 (2013.01); H01L 29/0619 (2013.01); H01L 29/4232 (2013.01); H01L 27/0207 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A semiconductor device includes a plurality of transistor components disposed on a semiconductor substrate, and a guard ring disposed on the semiconductor substrate surrounding the transistor components. The guard ring includes a plurality of fin structures disposed in parallel on the semiconductor substrate, a plurality of first conductive connection members disposed on the fin structures and connecting at least two fin structures, and a plurality of second conductive connection members connecting at least two first conductive connection members. The first conductive connection members and the second conductive connection members are formed as one structure.


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