The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2017
Filed:
Jul. 20, 2016
Applicant:
Powertech Technology Inc., Hsinchu County, TW;
Inventors:
Chia-Wei Chang, Hsinchu County, TW;
Kuo-Ting Lin, Hsinchu County, TW;
Assignee:
POWERTECH TECHNOLOGY INC., Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 21/50 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/49838 (2013.01); H01L 24/03 (2013.01); H01L 24/09 (2013.01); H01L 24/43 (2013.01); H01L 24/49 (2013.01); H01L 25/50 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06582 (2013.01); H01L 2924/181 (2013.01);
Abstract
A multi-chip package having no substrate is presented. The multi-chip package includes a chip stacked assembly, a first redistribution layer, a plurality of wire bonds, a plurality of metal pillars, an encapsulation, a second redistribution layer, and a plurality of vertical interposers. The first redistribution layer and the second redistribution layer are used in place of a substrate to reduce the thickness of the multi-chip package. In this way, a package-on-package device formed using the multi-chip package has a reduced thickness.