The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2017

Filed:

Jul. 10, 2015
Applicant:

Sas Ip, Inc., Cheyenne, WY (US);

Inventors:

Guangran Zhu, Oakdale, PA (US);

Werner Thiel, Pittsburgh, PA (US);

J. E. Bracken, Harrison City, PA (US);

Assignee:

Ansys, Inc., Canonsburg, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5081 (2013.01); G06F 17/5009 (2013.01);
Abstract

Systems and methods are provided for analyzing a via. A physical representation of a via intersecting with an upper layer and a lower layer is received, the physical representation comprising: (i) a pair of pad dimensions comprising an upper pad dimension aand a lower pad dimension a, and/or (ii) a pair of anti-pad dimensions comprising an upper anti-pad dimension band a lower anti-pad dimension b, where at least one of first and second conditions: (A) the first condition being ais different than a, and (B) the second condition being bis different than b, is true. A determination is made as to which, if any, of the conditions are true. At least one model parameter is selected based on the determination. An admittance parameter corresponding to a section of the via located between the upper and lower layers is computed using the selected model parameter.


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