The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Feb. 06, 2013
Applicant:
Atotech Deutschland Gmbh, Berlin, DE;
Inventors:
Richard Nichols, Berlin, DE;
Don Jang, Berlin, DE;
Harald Riebel, Berlin, DE;
Frank Brüning, Berlin, DE;
Assignee:
Atotech Deutschland GmbH, Berlin, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/56 (2006.01); C25D 7/00 (2006.01); H05K 3/38 (2006.01); H05K 3/42 (2006.01); C25D 5/02 (2006.01); H05K 3/46 (2006.01); C23C 18/40 (2006.01); C25D 7/06 (2006.01); H05K 3/06 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); H05K 3/10 (2006.01); C25D 3/38 (2006.01); C23C 18/30 (2006.01);
U.S. Cl.
CPC ...
H05K 3/387 (2013.01); C23C 18/1653 (2013.01); C23C 18/2006 (2013.01); C23C 18/40 (2013.01); C25D 5/022 (2013.01); C25D 5/56 (2013.01); C25D 7/00 (2013.01); C25D 7/06 (2013.01); H05K 3/06 (2013.01); H05K 3/381 (2013.01); H05K 3/389 (2013.01); H05K 3/421 (2013.01); H05K 3/4644 (2013.01); C23C 18/2066 (2013.01); C23C 18/30 (2013.01); C23C 18/405 (2013.01); C25D 3/38 (2013.01); H05K 3/108 (2013.01); H05K 3/388 (2013.01); H05K 2203/0789 (2013.01); H05K 2203/0793 (2013.01); H05K 2203/0796 (2013.01);
Abstract
The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer on the smooth surface of a build-up layer and a second conductive layer selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls of at least one opening which are formed after depositing the first conductive layer.