The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Mar. 29, 2011
Applicants:

Hideyo Osanai, Nagano, JP;

Takayuki Takahashi, Nagano, JP;

Satoru Ideguchi, Nagano, JP;

Hirotaka Kotani, Nagano, JP;

Inventors:

Hideyo Osanai, Nagano, JP;

Takayuki Takahashi, Nagano, JP;

Satoru Ideguchi, Nagano, JP;

Hirotaka Kotani, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B21D 39/00 (2006.01); H05K 1/05 (2006.01); H05K 3/02 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); B22D 19/00 (2006.01); B22D 19/04 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/053 (2013.01); B22D 19/0081 (2013.01); B22D 19/04 (2013.01); H01L 21/481 (2013.01); H01L 21/4871 (2013.01); H01L 23/3735 (2013.01); H05K 3/022 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0306 (2013.01); H05K 3/0061 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/2009 (2013.01); H05K 2203/128 (2013.01); Y10T 428/12618 (2015.01); Y10T 428/2457 (2015.01); Y10T 428/2462 (2015.01); Y10T 428/24942 (2015.01);
Abstract

A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.


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