The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

May. 03, 2016
Applicant:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Inventors:

Huayong Hu, Shanghai, CN;

Lei Ye, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 27/11582 (2017.01); H01L 21/28 (2006.01); H01L 21/311 (2006.01); H01L 21/027 (2006.01); H01L 21/768 (2006.01); H01L 29/49 (2006.01); H01L 27/11556 (2017.01);
U.S. Cl.
CPC ...
H01L 27/11582 (2013.01); H01L 21/0273 (2013.01); H01L 21/28273 (2013.01); H01L 21/28282 (2013.01); H01L 21/31116 (2013.01); H01L 21/31138 (2013.01); H01L 21/31144 (2013.01); H01L 21/76805 (2013.01); H01L 21/76877 (2013.01); H01L 27/11556 (2013.01); H01L 29/495 (2013.01); H01L 29/4916 (2013.01);
Abstract

A method for forming a 3D NAND structure includes providing a semiconductor substrate; forming a control gate structure having a plurality of staircase-stacked layers, each layer has a first end and a second end; forming a dielectric layer covering the semiconductor substrate, and the control gate structure; forming a hard mask layer on the dielectric layer; patterning the hard mask layer to form a plurality of openings above corresponding second ends of the layers of the control gate structure; forming a photoresist layer on the hard mask layer; repeating a photoresist trimming process and a first etching process to sequentially expose the openings, and to form a plurality of holes with predetermined depths in the dielectric layer; performing a second etching process to etch the plurality of holes until surfaces of the second ends are exposed to form through holes; and forming metal vias in the through holes.


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