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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9711484 B1

PDFFull Text
Date of Patent:
Jul. 18, 2017

Filed:

May. 29, 2015

Semiconductor package with semiconductor die directly attached to lead frame and method

Applicant:

Amkor Technology, Inc., Tempe, AZ (US);

Inventors:

Jong Sik Paek, Incheon, KR;

Doo Hyun Park, Gyeonggi-do, KR;

Wang Gu Lee, Gyeonggi-do, KR;

Yong Song, Seoul, KR;

Sung Geun Kang, Gyeonggi-do, KR;

Assignee:

Amkor Technology, Inc., Tempe, AZ (US);

Attorney:

Kevin B. Jackson

Primary Examiner:

Teresa M Arroyo

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); H01L 23/3107 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49551 (2013.01); H01L 23/49582 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 2224/1354 (2013.01); H01L 2224/27462 (2013.01); H01L 2224/27464 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/82355 (2013.01);
Abstract

In one embodiment, a semiconductor package includes a semiconductor die having conductive pads. A lead frame is directly connected to the conductive pads using an electrochemically formed layer or a conductive adhesive layer thereby facilitating an electrical connection between the conductive pads of the semiconductor die and the lead frame without using separate wire bonds or conductive bumps.

Find Patent Forward Citations

Paek, Jong. (2017). Semiconductor package with semiconductor die directly attached to lead frame and method (U.S. Patent No. 9711484). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9711484

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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