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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9711476 B1

PDFFull Text
Date of Patent:
Jul. 18, 2017

Filed:

Jun. 06, 2016

Wiring board and electronic component device

Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventors:

Tomoyuki Shimodaira, Nagano, JP;

Takahiro Rokugawa, Nagano, JP;

Hitoshi Kondo, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi, JP;

Attorney:

Rankin, Hill & Clark LLP

Primary Examiner:

William Harriston

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 21/4857 (2013.01); H01L 21/563 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 23/562 (2013.01); H01L 2224/16238 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/3512 (2013.01);
Abstract

A wiring board includes: an insulating layer; a pad including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the side surface and the lower surface of the pad are embedded in the insulating layer; and a metal post formed on the upper surface of the pad and including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein a narrowed portion is formed in the side surface of the metal post.

Find Patent Forward Citations

Shimodaira, Tomoyuki. (2017). Wiring board and electronic component device (U.S. Patent No. 9711476). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9711476

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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