The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Oct. 20, 2016
Shinko Electric Industries Co., Ltd., Nagano-Ken, JP;
Abstract
A wiring substrate includes first through holes extending through an insulation layer, first via wirings formed in the first through holes, a conductive pattern connected to the first via wirings, recesses formed in the first via wirings, and a protective insulation layer covering the conductive pattern and the first via wirings. The first via wirings, the conductive pattern, the recesses, and the protective insulation layer form an identification mark identifiable as a particular shape including a character or a symbol. Each recess is defined by an upper surface of the corresponding first via wiring and includes a curved side wall and a bottom wall that is located at a lower position than an upper surface of the conductive pattern. The protective insulation layer is thicker over the first via wirings than over the conductive pattern.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile