The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Dec. 16, 2010
Applicants:
Zvi Or-bach, San Jose, CA (US);
Brian Cronquist, San Jose, CA (US);
Israel Beinglass, Sunnyvale, CA (US);
J. L. DE Jong, Cupertino, CA (US);
Deepak C. Sekar, San Jose, CA (US);
Paul Lim, Fremont, CA (US);
Inventors:
Zvi Or-Bach, San Jose, CA (US);
Brian Cronquist, San Jose, CA (US);
Israel Beinglass, Sunnyvale, CA (US);
J. L. de Jong, Cupertino, CA (US);
Deepak C. Sekar, San Jose, CA (US);
Paul Lim, Fremont, CA (US);
Assignee:
Monolithic 3D Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/822 (2006.01); H01L 21/84 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/525 (2006.01); H01L 23/544 (2006.01); H01L 25/065 (2006.01); H01L 27/02 (2006.01); H01L 27/092 (2006.01); H01L 27/10 (2006.01); H01L 27/105 (2006.01); H01L 27/108 (2006.01); H01L 27/115 (2017.01); H01L 27/118 (2006.01); H01L 29/66 (2006.01); H01L 29/423 (2006.01); H01L 29/78 (2006.01); G06F 17/50 (2006.01); H01L 21/762 (2006.01); H01L 21/8238 (2006.01); H01L 25/00 (2006.01); H01L 27/06 (2006.01); H01L 27/11 (2006.01); H01L 27/112 (2006.01); H01L 27/11526 (2017.01); H01L 27/11529 (2017.01); H01L 27/11551 (2017.01); H01L 27/11573 (2017.01); H01L 27/11578 (2017.01); H01L 27/12 (2006.01); H01L 29/788 (2006.01); H01L 29/792 (2006.01); H01L 23/367 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/8221 (2013.01); G06F 17/5072 (2013.01); H01L 21/6835 (2013.01); H01L 21/76254 (2013.01); H01L 21/823828 (2013.01); H01L 21/84 (2013.01); H01L 23/5252 (2013.01); H01L 23/544 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 27/0207 (2013.01); H01L 27/0688 (2013.01); H01L 27/092 (2013.01); H01L 27/10 (2013.01); H01L 27/105 (2013.01); H01L 27/10802 (2013.01); H01L 27/10876 (2013.01); H01L 27/10894 (2013.01); H01L 27/10897 (2013.01); H01L 27/11 (2013.01); H01L 27/112 (2013.01); H01L 27/1108 (2013.01); H01L 27/11526 (2013.01); H01L 27/11529 (2013.01); H01L 27/11551 (2013.01); H01L 27/11573 (2013.01); H01L 27/11578 (2013.01); H01L 27/11807 (2013.01); H01L 27/11898 (2013.01); H01L 27/1203 (2013.01); H01L 29/4236 (2013.01); H01L 29/66272 (2013.01); H01L 29/66621 (2013.01); H01L 29/66825 (2013.01); H01L 29/66833 (2013.01); H01L 29/66901 (2013.01); H01L 29/78 (2013.01); H01L 29/7841 (2013.01); H01L 29/7848 (2013.01); H01L 29/7881 (2013.01); H01L 29/792 (2013.01); H01L 23/3677 (2013.01); H01L 23/481 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 27/10873 (2013.01); H01L 27/11206 (2013.01); H01L 27/1214 (2013.01); H01L 27/1266 (2013.01); H01L 2221/68368 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83894 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01018 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01066 (2013.01); H01L 2924/01072 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01076 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30105 (2013.01);
Abstract
A semiconductor device includes a first mono-crystallized layer including first transistors, and a first metal layer forming at least a portion of connections between the first transistors; and a second layer including second transistors, the second transistors including mono-crystalline material, the second layer overlying the first metal layer, wherein the first metal layer includes aluminum or copper, and wherein the second layer is less than one micron in thickness and includes logic cells.