The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Jul. 09, 2015
Applicant:

Tyco Electronics Corporation, Berwyn, PA (US);

Inventors:

Mudhafar Hassan-Ali, Menlo Park, CA (US);

Jason Larson, San Lorenzo, CA (US);

Assignee:

TE Connectivity Corporation, Berwyn, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02J 7/00 (2006.01); H01F 27/28 (2006.01); H01F 5/00 (2006.01); H01F 27/42 (2006.01); H01F 38/14 (2006.01); H02J 5/00 (2016.01); H02J 7/02 (2016.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 38/14 (2013.01); H02J 5/005 (2013.01); H02J 7/025 (2013.01); H01F 2027/2809 (2013.01);
Abstract

Printed circuit includes a substrate body having a plurality of substrate layers stacked along a Z-axis. Each substrate layer is substantially planar and extends along an XY plane. The X-, Y-, and Z-axes are mutually perpendicular. The printed circuit also includes a Z-field coil that is coupled to the substrate body and has a conductive trace that is parallel to the XY plane. The printed circuit also includes an X-field coil having conductive trace segments that are coupled to the substrate body and parallel to the XY plane. The X-field coil includes conductive paths that extend substantially parallel to the Z-axis. The conductive paths interconnect the trace segments. The Z-field coil and the X-field coil are configured to generate respective vector components of a magnetic field or have a voltage induced therein by a magnetic field.


Find Patent Forward Citations

Loading…