The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2017

Filed:

Mar. 03, 2014
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Yasushi Ota, Akashi, JP;

Genki Matsumoto, Akashi, JP;

Koji Fukata, Akashi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23C 5/16 (2006.01); B23C 5/10 (2006.01);
U.S. Cl.
CPC ...
B23C 5/10 (2013.01); B23C 5/16 (2013.01); B23C 2210/0457 (2013.01); B23C 2210/088 (2013.01); B23C 2220/60 (2013.01); B23C 2224/32 (2013.01); B23C 2224/36 (2013.01); B23C 2228/08 (2013.01); B23C 2228/10 (2013.01);
Abstract

Even if chips enter a gap between a flank face and a surface to be worked, the defect of the flank face or a cutting edge is suppressed by the control of the flow of the chips. A plurality of cutting edges, which are undulated in wave forms in a direction of an axis, are formed on an outer periphery of a front end portion of an end mill body rotating about the axis so that phases of the wave forms are displaced from each other in a path of rotation about the axis; flank faces of the cutting edges are covered with a coating film; and rough surface regions and smooth surface regions are alternately formed on the surface of at least portions of the coating film, which are close to the cutting edges, in the direction of the axis.


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