The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2017
Filed:
Nov. 10, 2011
Yuzo Daigo, Kitamoto, JP;
Shinichi Ohmori, Kitamoto, JP;
Komei Kato, Saitama, JP;
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Abstract
Porous implant material having a plurality of metal bodies having different porosity rates which are bonded with each other at bonded-boundary surface F parallel to a first direction, wherein: a bonded body of the metal bodies has an entire porosity rate of 50% to 92%; the metal body having higher porosity rate is a porous metal body having a three-dimensional network formed from a continuous skeleton in which a plurality of pores are interconnected; the metal body having lower porosity rate has a porosity rate of 0 to 50% and an area-occupation rate of 0.5% to 50% in a cross-section surface orthogonal to an axial direction which agrees with the first direction along the bonded-boundary surface; and a compressive strength compressing in a direction parallel to the bonded-boundary surface is 1.4 times to 10 times of a compressive strength compressing in a direction orthogonal to the bonded-boundary surface.