The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Oct. 30, 2015
Fukui Precision Component (Shenzhen) Co., Ltd., Shenzhen, CN;
Hongqisheng Precision Electronics (Qinhuangdao) Co.,ltd., Qinhuangdao, CN;
Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;
Ming-Jaan Ho, New Taipei, TW;
Xian-Qin Hu, Shenzhen, CN;
Yi-Qiang Zhuang, Shenzhen, CN;
Fu-Wei Zhong, Shenzhen, CN;
FuKui Precision Component (Shenzhen) Co., Ltd., Shenzhen, CN;
HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd., Qinhuangdao, CN;
GARLIDA TECHNOLOGY CO., LTD., Taipei, TW;
Abstract
A printed circuit board includes a first printed circuit substrate and a second printed circuit substrate. The first printed circuit substrate includes a substrate layer and a first conductive circuit layer. The first conductive circuit layer is formed on the substrate layer. The substrate layer includes at least two first grooves. The first conductive circuit layer includes at least one signal wire. The first grooves are defined in both sides of the signal wire. The second printed circuit substrate is formed on the first printed circuit substrate. The second circuit substrate includes a third copper layer. A second groove is defined in the third copper layer. The first grooves are opposite to the second groove. The first grooves and the second groove form a space. The signal wire is surrounded by air in the space. A method for manufacturing the printed circuit board is also provided.