The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2017

Filed:

Aug. 07, 2015
Applicant:

Ibiden Co., Ltd., Ogaki-shi, JP;

Inventors:

Yasushi Inagaki, Ogaki, JP;

Kota Noda, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 21/48 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/49811 (2013.01); H05K 1/0278 (2013.01); H05K 3/4015 (2013.01); H01L 21/4857 (2013.01); H01L 23/49827 (2013.01); H01L 2924/0002 (2013.01); H05K 1/111 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/09827 (2013.01);
Abstract

A printed wiring board includes an insulating layer, a first conductor layer embedded into first surface of the insulating layer and including multiple wirings such that the wirings include connecting portions positioned to connect an electronic component, respectively, a second conductor layer projecting from second surface of the insulating layer on the opposite side, a solder resist layer formed on the first surface of the insulating layer such that the solder resist layer is covering the first conductor layer and has an opening structure exposing the connecting portions of the wirings, and multiple metal posts formed on the connecting portions respectively such that each of the metal posts has a width which is larger than a width of a respective one of the wirings having the connecting portions. The wirings are formed such that the connecting portions are positioned side by side on every other adjacent one of the wirings.


Find Patent Forward Citations

Loading…