The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Jun. 25, 2015
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Joerg Ortner, Drobollach, AT;
Michael Roesner, Villach, AT;
Gudrun Stranzl, Goedersdorf, AT;
Rudolf Rothmaler, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/308 (2006.01); H01L 21/3065 (2006.01); G03F 1/38 (2012.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); G03F 1/38 (2013.01); H01L 21/3065 (2013.01); H01L 21/3083 (2013.01);
Abstract
A method of dicing a wafer includes providing a wafer and etching the wafer to singulate die between kerf line segments defined within an interior region of the wafer and to singulate a plurality of wafer edge areas between the kerf line segments and a circumferential edge of the wafer. Each one of the plurality of wafer edge areas is singulated by kerf lines that each extend between one of two endpoints of one of the kerf line segments and the circumferential edge of the wafer.