The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Jan. 23, 2014
Applicant:
Freescale Semiconductor, Inc., Austin, TX (US);
Inventors:
Sriram Neelakantan, Austin, TX (US);
Trent S. Uehling, New Braunfels, TX (US);
Assignee:
NXP USA, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
G02B 6/428 (2013.01); G02B 6/42 (2013.01); G02B 6/43 (2013.01); H01L 27/14629 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01); H01L 27/14689 (2013.01); G02B 6/4202 (2013.01); G02B 6/4214 (2013.01);
Abstract
A method and apparatus are provided for fabricating an electro-optical interconnect on an integrated circuit () in which an optical circuit element () is formed by forming a cylinder-shaped conductive interconnect structure () with one or more conductive layers formed around a central opening () which is located over an optically transparent layer () located over the optical circuit element ().