The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Jan. 12, 2016
Applicants:
Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);
Dow Global Technologies Llc, Midland, MI (US);
Inventors:
David S. Laitar, Midland, MI (US);
Crystal P. L. Li, Tin Shui Wai, HK;
Andy Lok-Fung Chow, Tseung Kwan O, HK;
Assignees:
Dow Global Technologies LLC, Midland, MI (US);
Rohm and Haas Electronic Materials LLC, Marlborough, MA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 18/54 (2006.01); C23C 18/16 (2006.01); H05K 3/00 (2006.01); C23C 18/40 (2006.01); H05K 3/18 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
C23C 18/40 (2013.01); C23C 18/1633 (2013.01); C23C 18/54 (2013.01); H05K 3/00 (2013.01); H05K 3/0094 (2013.01); H05K 3/181 (2013.01); H05K 3/422 (2013.01);
Abstract
Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.