The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
Apr. 24, 2013
Tokyo Seimitsu Co., Ltd., Hachioji-Shi, Tokyo, JP;
Shin-nihon Tech Inc., Osaka-Shi, Osaka, JP;
Junji Watanabe, Sakai-shi, Osaka, JP;
Tokyo Seimitsu Co., Ltd., Hachioji-Shi, Tokyo, JP;
Shin-Nihon Tech Inc., Osaka-Shi, Osaka, JP;
Abstract
An object of the present invention is to provide a dicing blade which does not cause cracking and breaking even in a workpiece formed from a brittle material, and can stably perform cutting process in a ductile mode on the workpiece with high precision. A dicing bladewhich performs the cutting process on the workpiece is integrally formed of a diamond sintered bodywhich is formed by sintering diamond abrasive grainsso as to have a discoid shape, and a content of the diamond abrasive grainsof the diamond sintered bodyis 80 vol % or more. It is preferable that recessed parts which are formed on a surface of the diamond sintered bodyare continuously provided in an outer circumferential part of the dicing bladealong a circumferential direction.