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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9700961 B1

PDFFull Text
Date of Patent:
Jul. 11, 2017

Filed:

Oct. 04, 2012

Ablation method for die attach film

Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Nobuyasu Kitahara, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain, Ltd.

Primary Examiner:

Jeffrey Wollschlager

Assistant Examiner:

Armand Melendez

Int. Cl.
CPC ...
B23K 26/18 (2006.01); H01L 21/78 (2006.01); H01L 21/3065 (2006.01); B23K 26/36 (2014.01); H01L 21/683 (2006.01); B23K 26/40 (2014.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
B23K 26/18 (2013.01); B23K 26/36 (2013.01); B23K 26/40 (2013.01); H01L 21/3065 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); B23K 2203/172 (2015.10); H01L 21/67092 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 2221/68377 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/94 (2013.01); H01L 2924/12042 (2013.01);
Abstract

An ablation method of applying a laser beam to a die attach film to perform ablation. The ablation method includes a protective film forming step of applying a liquid resin containing a fine powder of oxide having absorptivity to the wavelength of the laser beam to at least a subject area of the die attach film to be ablated, thereby forming a protective film containing the fine powder on at least the subject area of the die attach film, and a laser processing step of applying the laser beam to the subject area coated with the protective film, thereby performing ablation through the protective film to the subject area of the die attach film after performing the protective film forming step.

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