The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Jan. 30, 2015
Applicant:
Ibiden Co., Ltd., Ogaki-shi, JP;
Inventor:
Kota Noda, Ogaki, JP;
Assignee:
IBIDEN CO., LTD., Ogaki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 3/40 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4015 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 25/105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/1533 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/18161 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/0338 (2013.01); Y10T 29/49147 (2015.01);
Abstract
A printed wiring board includes a first substrate having first pads and second pads such that the first pads are positioned to mount an electronic component on the first substrate and that the second pads are positioned to electrically connect a second substrate to the first substrate, and metal posts formed on the second pads, respectively, such that the metal posts are positioned to mount the second substrate on the first substrate. The first substrate and the metal posts satisfy that a ratio, b/e, is in a range from 0.3 to 1.0, where b represents a length of each of the metal posts and e represents a thickness of the first substrate.