The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Apr. 13, 2016
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventors:
Toyoaki Sakai, Nagano, JP;
Tomoyuki Shimodaira, Nagano, JP;
Shunichiro Matsumoto, Nagano, JP;
Kentaro Kaneko, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/03 (2006.01); H05K 1/16 (2006.01); H05K 1/11 (2006.01); H05K 7/10 (2006.01); H05K 7/00 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 1/14 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); H05K 3/4682 (2013.01); H05K 3/4694 (2013.01); H05K 1/144 (2013.01); H05K 3/3436 (2013.01); H05K 2201/0191 (2013.01);
Abstract
A wiring board includes an insulating layer; and a wiring layer embedded in the insulating layer at one surface side of the insulating layer, one surface of the wiring layer being exposed from one surface of the insulating layer, the wiring layer including a first portion and a second portion whose width is wider than that of the first portion, one surface of the first portion and one surface of the second portion being flush with each other, and the first portion being thinner than the second portion.