The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Dec. 31, 2015
Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventor:

Guowei Zhang, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/40 (2006.01); H01L 29/08 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7825 (2013.01); H01L 29/063 (2013.01); H01L 29/0615 (2013.01); H01L 29/0865 (2013.01); H01L 29/0882 (2013.01); H01L 29/402 (2013.01); H01L 29/408 (2013.01); H01L 29/66484 (2013.01); H01L 29/66704 (2013.01);
Abstract

High voltage devices and methods for forming a high voltage device are disclosed. The method includes providing a substrate having top and bottom surfaces. The substrate is defined with a device region and a recessed region disposed within the device region. The recessed region includes a recessed surface disposed lower than the top surface of the substrate. A transistor is formed over the substrate. Forming the transistor includes forming a gate at least over the recessed surface and forming a source region adjacent to a first side of the gate below the recessed surface. Forming the transistor also includes forming a drain region displaced away from a second side of the gate. First and second device wells are formed in the substrate within the device region. The first device well encompasses the drain region and the second device well encompasses the source region.


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