The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Jun. 27, 2016
Applicant:

Qorvo Us, Inc., Greensboro, NC (US);

Inventors:

Peter J. Zampardi, Newbury Park, CA (US);

Brian G. Moser, Jamestown, NC (US);

Michael Meeder, Jamestown, NC (US);

Venkata Chivukula, Durham, NC (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 29/872 (2006.01); H01L 29/20 (2006.01); H01L 29/16 (2006.01); H01L 27/06 (2006.01); H01L 23/66 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0248 (2013.01); H01L 23/66 (2013.01); H01L 27/0605 (2013.01); H01L 27/0676 (2013.01); H01L 28/60 (2013.01); H01L 29/16 (2013.01); H01L 29/20 (2013.01); H01L 29/2003 (2013.01); H01L 29/872 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6683 (2013.01);
Abstract

Electrostatic Discharge (ESD) protection using lateral surface Schottky diodes is disclosed. In one embodiment, a Metal-Insulator-Metal (MIM) capacitor with ESD protection comprises a group III-V substrate, a first metal layer contacting the substrate, an insulation layer formed over the first metal layer, and a second metal layer formed over the insulation layer and also contacting the substrate. A MIM capacitor is formed by overlapping portions of the first metal layer, the insulation layer, and the second metal layer. First and second Schottky diodes are formed where the first and second metal layers, respectively, contact the substrate, such that the cathodes of the Schottky diodes are electrically connected to one another and the anodes of the Schottky diodes are electrically connected to the respective overlapping portions of the first and second metal layers.


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