The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Sep. 22, 2016
Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Gerald Weis, St. Marein im Murztal, AT;

Christian Vockenberger, Leoben, AT;

Roland Sekavcnik, Leoben, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 25/16 (2006.01); H01L 23/467 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H01L 25/16 (2013.01); H01L 23/3677 (2013.01); H01L 23/467 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/17 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/074 (2013.01); H01L 25/105 (2013.01); H05K 1/0206 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 7/20154 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2518 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1047 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/153 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/19105 (2013.01); H05K 1/0209 (2013.01); H05K 1/0212 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10166 (2013.01);
Abstract

In a connection system for electronic components () comprising a plurality of insulating layers () and conductive layers () and further comprising at least one embedded electronic component () embedded within at least one of the plurality of insulating layers () and conductive layers () the at least one embedded electronic component () is at least one first transistor having a bulk terminal thereof in thermal contact with a thermal duct () comprised of a plurality of vias () reaching through at least one of an insulating layer () and a conductive layer () of the connection system for electronic components () and emerging on a first outer surface () of the connection system for electronic components () under a first surface-mounted component ().


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