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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9698094 B1

PDFFull Text
Date of Patent:
Jul. 04, 2017

Filed:

Aug. 04, 2016

Wiring board and electronic component device

Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventors:

Hiroharu Yanagisawa, Nagano, JP;

Kazuhiro Kobayashi, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-shi, JP;

Attorney:

Rankin, Hill & Clark LLP

Primary Examiner:

Jasmine Clark

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/563 (2013.01); H01L 23/3178 (2013.01); H01L 23/49827 (2013.01); H01L 24/16 (2013.01); H05K 1/0213 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H01L 2224/16227 (2013.01);
Abstract

A wiring board includes: an insulating layer; and a wiring layer including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the upper surface of the wiring layer is exposed from the insulating layer, and the side surface and the lower surface of the wiring layer are embedded in the insulating layer. A recess portion is formed in an outer edge portion of the upper surface of the wiring layer, and the recess portion is filled with the insulating layer.

Find Patent Forward Citations

Yanagisawa, Hiroharu. (2017). Wiring board and electronic component device (U.S. Patent No. 9698094). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9698094

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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