The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Feb. 18, 2013
Applicant:

Soitec, Crolles, FR;

Inventors:

Patrick Reynaud, Murianette, FR;

Walter Schwarzenbach, Saint Nazaire les Eymes, FR;

Konstantin Bourdelle, Crolles, FR;

Jean-Francois Gilbert, Saint-Hilaire-du-Touvet, FR;

Assignee:

SOITEC, Bernin, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01R 31/26 (2014.01);
U.S. Cl.
CPC ...
H01L 22/14 (2013.01); G01R 31/2601 (2013.01); H01L 22/20 (2013.01);
Abstract

The invention concerns a method of testing a semiconductor-on-insulator type structure comprising a support substrate, a dielectric layer having a thickness of less than 50 nm and a semiconductor layer, the structure comprising a bonding interface between the dielectric layer and the support substrate or the semiconductor layer or inside the dielectric layer, characterized in that it comprises measuring the charge to breakdown (Q) of the dielectric layer and in that information is deduced from the measurement relating to the hydrogen concentration in the layer and/or at the bonding interface. The invention also concerns a method of fabricating a batch of semiconductor-on-insulator type structures including carrying out the test on a sample structure from the batch.


Find Patent Forward Citations

Loading…