The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2017

Filed:

Sep. 04, 2014
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Steven Bentley, Watervliet, NY (US);

Richard A. Farrell, Albany, NY (US);

Gerard Schmid, Rensselaer, NY (US);

Ajey Poovannummoottil Jacob, Watervliet, NY (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 21/308 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); H01L 29/66 (2006.01); H01L 29/775 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31144 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); H01L 21/3086 (2013.01); H01L 29/068 (2013.01); H01L 29/0649 (2013.01); H01L 29/0676 (2013.01); H01L 29/66439 (2013.01); H01L 29/66469 (2013.01); H01L 29/775 (2013.01); H01L 29/7851 (2013.01); H01L 29/7854 (2013.01); H01L 21/823487 (2013.01);
Abstract

A method includes forming at least one fin on a semiconductor substrate. A hard mask layer is formed above the fin. A first directed self-assembly material is formed above the hard mask layer. The hard mask layer is patterned using a portion of the first directed self-assembly material as an etch mask to expose a portion of the top surface of the fin. A substantially vertical nanowire is formed on the exposed top surface. At least one dimension of the substantially vertical nanowire is defined by an intrinsic pitch of the first directed self-assembly material.


Find Patent Forward Citations

Loading…