The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Dec. 20, 2013
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Shuji Nishimoto, Ageo, JP;
Yoshiyuki Nagatomo, Saitama, JP;
Assignee:
Mitsubishi Materials Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H01L 23/373 (2006.01); C04B 37/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01); H05K 7/14 (2006.01); H01L 23/42 (2006.01); H05K 3/00 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); C04B 37/021 (2013.01); H01L 23/3735 (2013.01); H05K 1/0203 (2013.01); H05K 1/0298 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 3/465 (2013.01); H05K 7/14 (2013.01); C04B 2237/343 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/402 (2013.01); C04B 2237/407 (2013.01); C04B 2237/86 (2013.01); H01L 23/42 (2013.01); H01L 23/473 (2013.01); H01L 2224/32225 (2013.01); H05K 3/0061 (2013.01);
Abstract
A power module substrate includes an insulating layer, a circuit layer that is formed on a first surface of the insulating layer, and a metal layer that is formed on a second surface of the insulating layer, in which a first base layer is laminated on a surface of the metal layer on the opposite side of the surface to which the insulating layer is provided, and the first base layer has: a first glass layer that is formed at the interface with the metal layer; and a first Ag layer that is laminated on the first glass layer.