The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Mar. 28, 2014
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Dai Nippon Printing Co., Ltd., Shinjuku-Ku, JP;
Abstract
To provide an element manufacturing method and element manufacturing apparatus for efficiently manufacturing an element such as an organic semiconductor element. First, an intermediate product, which includes a substrate and a protrusion extending in a normal direction of the substrate, is formed. Next, the intermediate product is covered, at a side where the protrusion is provided, with a first surface of a lid member. After the covering of the intermediate product, a gas is injected into an enclosed space formed at a side of a second surface of the lid member that is present on an opposite side of the first surface. This enhances an internal pressure of the enclosed space, thus bringing the first surface of the lid member into close contact with the intermediate product.