The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Sep. 30, 2015
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Harry Hak-Lay Chuang, Paya Lebar Crescent, SG;
Tien-Wei Chiang, Taipei, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 43/08 (2006.01); H01L 43/02 (2006.01); G11C 11/16 (2006.01); H01L 27/22 (2006.01); H01L 43/12 (2006.01);
U.S. Cl.
CPC ...
H01L 43/08 (2013.01); G11C 11/161 (2013.01); H01L 27/222 (2013.01); H01L 27/226 (2013.01); H01L 43/02 (2013.01); H01L 43/12 (2013.01);
Abstract
The present disclosure relates to a semiconductor integrated circuit which includes a substrate, a first patterned conductive layer, a first magnetic tunnel junction (MTJ) stack and a second MTJ stack. The first patterned conductive layer is over the substrate. The first MTJ stack, which is over the first patterned conductive layer, has a first size. The second MTJ stack, which is over the first patterned conductive layer, has a second size different from the first size.