The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Aug. 28, 2015
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Wataru Tsukada, Sagamihara, JP;
Masayuki Honda, Tokyo, JP;
Yoshihisa Fukushima, Tokyo, JP;
Scott Richard Cyr, Eagle, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/13 (2006.01); H01L 25/18 (2006.01); H01L 25/065 (2006.01); G11C 5/04 (2006.01); G11C 5/06 (2006.01); G11C 29/02 (2006.01); G11C 29/50 (2006.01); G11C 7/10 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); G11C 5/04 (2013.01); G11C 5/063 (2013.01); G11C 29/025 (2013.01); G11C 29/50008 (2013.01); H01L 25/0655 (2013.01); G11C 7/1048 (2013.01); G11C 2207/105 (2013.01); H01L 23/5386 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor module includes a module substrate, a line pattern provided to the module substrate, first and second semiconductor chips on the module substrate and coupled to the line pattern, and a termination resister on the module substrate and coupled to the line pattern, the termination resistor being located between the first and second semiconductor chips.