The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2017
Filed:
Jan. 10, 2016
Applicant:
United Microelectronics Corp., Hsin-Chu, TW;
Inventor:
Ye Wang, Singapore, SG;
Assignee:
UNITED MICROELECTRONICS CORP., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 23/3192 (2013.01); H01L 23/528 (2013.01); H01L 23/53219 (2013.01); H01L 23/53223 (2013.01); H01L 23/53295 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/03009 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05181 (2013.01); H01L 2224/05186 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/131 (2013.01);
Abstract
A bond pad structure with dual passivation layers is disclosed. The bond pad structure includes: a pad material layer on a first passivation layer; a protection layer on the top surface of the pad material layer; a second passivation layer covering on the first passivation layer and the protection layer; and an opening formed through the second passivation layer and the protection layer to expose the pad material layer.