The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2017

Filed:

Sep. 11, 2015
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Satoshi Toda, Nirasaki, JP;

Kenshirou Asahi, Nirasaki, JP;

Hiroyuki Takahashi, Nirasaki, JP;

Kimihiko Demichi, Nirasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31116 (2013.01); H01L 21/30604 (2013.01); H01L 21/30621 (2013.01); H01L 21/311 (2013.01); H01L 21/32135 (2013.01);
Abstract

There is provided an etching method, including: disposing a target substrate within a chamber, the target substrate having a first silicon oxide film formed on a surface of the target substrate and a second silicon oxide film formed adjacent to the first silicon oxide film, the first silicon oxide film being formed by an atomic layer deposition method and the second silicon oxide film being formed by a method other than the atomic layer deposition method; and selectively etching the first silicon oxide film with respect to the second silicon oxide film by supplying one selected from the group consisting of HF gas and alcohol gas; HF gas and water vapor; HF gas, Fgas, and alcohol gas; HF gas, Fgas, and water vapor, into the chamber.


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