The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2017
Filed:
Jul. 16, 2015
J-devices Corporation, Usuki-shi, Oita, JP;
Yoshihiko Ikemoto, Yokohama, JP;
Hiroshi Inoue, Yokohama, JP;
Kiminori Ishido, Yokohama, JP;
Hiroaki Matsubara, Yokohama, JP;
Yukari Imaizumi, Yokohama, JP;
J-DEVICES CORPORATION, Usuki-shi, Oita, JP;
Abstract
A semiconductor device including: a support plate; a semiconductor chipmounted on one principal surface of the support platevia an adhesive layer, with the element circuit surface of the chip being directed upward; an insulation material layerthat seals the semiconductor chipand the periphery of the semiconductor chip; openings formed on an electrode arranged on the element circuit surface of the semiconductor chipin the insulation material layer; conductive portionsformed in the openings so as to be connected to the electrode of the semiconductor chip; a wiring layerformed on the insulation material layerso as to be connected to the conductive portionsand partially extending to the peripheral region of the semiconductor chip; and external electrodesformed on the wiring layer