The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2017
Filed:
Feb. 03, 2015
Taiwan Semiconductor Manufacturing Company Limited, Hsin-Chu, TW;
Mu-Jen Huang, Taipei, TW;
Zhi Zhong Hu, Shanghai, CN;
Zong-liang Cao, Shanghai, CN;
Feng Zhu, Shanghai, CN;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Hsin-Chu, TW;
Abstract
One or more systems and techniques for modeling are provided. An original device model, such as a SPICE model, is used as a basis for fabricating a semiconductor arrangement, such as an integrated circuit arrangement, upon a semiconductor wafer. Fabrication process variations cause measured e-parameters and measured size e-parameters of the semiconductor arrangement to vary from original design parameters of the original device model. Accordingly, a partial set of e-parameters and a partial set of size e-parameters are measured from the semiconductor arrangement, and are expanded into a full set of e-parameters and a full set of size e-parameters using e-parameter derivation and size-centric derivation. The original device model is retargeted using the full set of e-parameters and the full set of size e-parameters to create a new device model that more accurately represents the real-world or fabricated semiconductor arrangement.