The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2017
Filed:
Mar. 28, 2014
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Dai Nippon Printing Co., Ltd., Shinjuku-Ku, JP;
Abstract
An element manufacturing method and apparatus for efficiently manufacturing an element such as an organic semiconductor element. First, an intermediate product that includes a substrate and a protrusion extending in a normal direction of the substrate is provided. Next, in a stacking chamber conditioned to a vacuum environment, a stacked structure is formed by continuously stacking a lid member on the intermediate product at a side where the protrusion is provided. After this operation, the stacked structure is transported from the stacking chamber to a first pressure chamber coupled to the stacking chamber and conditioned to a first pressure higher than the pressure in the vacuum environment. Next, the stacked structure is further transported from the first pressure chamber to a separation chamber coupled to the first pressure chamber and conditioned to a vacuum environment, and then the stacked structure is separated into the intermediate product and the lid member.