The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2017
Filed:
Jan. 07, 2016
Applicant:
Shinkawa Ltd., Tokyo, JP;
Inventor:
Shoji Wada, Tokyo, JP;
Assignee:
SHINKAWA LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 1/02 (2006.01); H01L 23/00 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 21/67103 (2013.01); H01L 2224/75251 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/75983 (2013.01);
Abstract
Provided is a bonding stage including: a rigid block () having a plurality of projections () on a surface () of the base body, upper surfaces of the projections being flat; a flat plate () fixed to supporting surfaces () on the projections (); a ceramic plate () suctioned and fixed to the flat plate (); a plate-shaped heater () disposed on a side of the rigid block () of the flat plate (); and coil springs () disposed between the heater () and the rigid block (), the coil springs () bringing the heater () into close contact with a surface of the flat plate () on the side of the rigid block ().